– The 5th International Seminar
5-6 March 2020
Meeting room 1
Anker Engelundsvej 1
2800 Kgs. Lyngby
During the past couple of decades, use of electronics have increased in gigantic proportions. Use of power electronics in various sectors is a typical example as well as electrification of automotive sector. The device needs to be highly reliable for use in various climatic conditions. Humidity can cause reliability issues in electronics resulting in intermittent malfunctions and permanent failures; many of them are due to transient water film formation on PCBA surface under climatic exposure. Therefore understanding, finding preventive measures, and design for humidity robustness is important. There can be extrinsic methods keeping humidity level low or intrinsic methods increasing the robustness of the PCBA and components. As such preventive measures can be individually or used in combination.
Following previous years successful seminars, we are pleased to announce the 5th international seminar on climatic reliability of electronics. The two days seminar will cover various aspects of humidity issues in electronics elucidating failure mechanisms, influencing factors, humidity and climate modelling, and various preventive measures. This is a focused seminar with invited talks delivered by experts in various areas from industry and academia on various issues.
There will be extended focus on networking between participants during the evening programmes. The seminar attracts delegates from academia and industry. We are delighted to invite you to attend this important seminar.
Seminar topics intended to cover, but not limited to:
- Corrosion reliability issues of electronics and failures mechanisms
- Humidity Issues related to low power and higher power electronics
- Humidity effects on PCBA: Material, component, design, and process aspects
- Electronic component level reliability issues
- Enclosure aspects in controlling humidity issues
- Moisture modelling and climate modelling for humidity effects prediction
- Preventive measures: Intrinsic reliability of PCBA, coatings, and extrinsic methods to control humidity in the device
(Some titles are not final. Also sequence of talks are not final: Final presentation schedule will be available soon)
|Introduction to the seminar, and overview of humidity effects on electronics and need today||Rajan Ambat, CELCORR, DTU, Denmark|
|Component Specific Test Boards and Electrical Test Methods for Assessing the Climatic Reliability of PCBAs||Mike Bixenman, Kyzen, USA|
|Electrochemical corrosion and thermal effects at voltages ≥ 12 V in electronics systems||Nicolas Mayer/Lutz Muller, Robert Bosch, Germany|
|Complementary EIS / FTIR study of the degradation of adhesives in electronic packaging||Michael Schneider, Fraunhofer-Institut für Keramische Technologien und Systeme IKTS, Germany|
|Studies on sprayed metal (schoopage) as humidity barrier in film capacitor||Azahara Albéndiz García, TDK Electronics Components, Spain|
|Chemical composition, evolution, deliquescence and conductivity of aerosol deposited on the insulators of the Italian national power lines||Luca Ferrero, University of Milan Biccoca, Italy|
|Carbonization of PCB material in relation to thermal incidents (Tentative title)||Lutz Muller, Robert Bosch, Germany|
|Beyond humidity testing: Mixed Flowing Gas Tests on Power Electronics||Tommi Kärkkäinen, LUT University in Lappeenranta, Finland|
|Humidity-induced failures in state-of-the-art power semiconductor devices||Christian Zorn University of Bremen, Germany|
|Alternative Detection methods for Humidity Impacts on PCBAs||Lauser Simone, Robert Bosch, Germany|
|Ultra-thin Fluoropolymer Coating: Performance and Ese in Electronics||Mélanie Mathon, Invetntec Performance Chemicals, France|
|Reliability of printed electronics (Tentative title)||Laura Frisk, Trelic, Finland
|Corrosion investigations on Bi and Mn micro-alloyed lead-free SAC alloys||Bálint Medgyes, BME, Budapest, Hungary|
|Mission profiling and corrosion classification: importance in relation to humidity effects on electronics (Tentative title)||Morten Jellesen, CELCORR, DTU, Denmark|
|Study of the degradation of different thermoelectric modules at Teide volcano||Leyre Catalán Ros Universidad Pública de Navarra, Spain|
|A validation tool for SMT-flux residues by infrared-spectroscopy based multi variate data analysis||Theresia Richter, Robert Bosch, Germany|
|Interaction of PCBA materials and Reliability Assessment||Henkel Adhesive Automotive Components, UK|
|Comparison of PCBs and DBCs concerning ECM and formation of dendrites||Victoria Zimmermann, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany|
|Reliability standards for cleanliness and coating: Protecting the future||Graham Naisbitt, GEN3 Systems, UK
|Moisture absorption by polymer materials and impact on humidity reliability of electronics (Tentative title)||Helene Conseil, CELCORR, DTU, Denmark
More detailed programme and information will be announced soon.
Professor Rajan Ambat, CELCORR, DTU
Dr. Morten Jellesen, CELCORR, DTU
4,500 kr. for members of ATV-SEMAPP or CreCon
5,000 kr. for non-members
All prices are excluded of Danish VAT.
The fee covers conference materials, lunch, coffee, and conference dinner and social events.
Upon registration we will send you an invoice.
Registration is binding, however substitutions are accepted at any time. Please let us know.
This seminar is organized by:
Centre for Electronic Corrosion (CELCORR), DTU
European Federation of corrosion (EFC), WP 23 on Corrosion Reliability of Electronics
European Centre for Power Electronics (ECPE)