Climatic Reliability of Electronics: Global Challenges and Perspectives

– The 5th International Seminar

5-6 March 2020

DTU Lyngby
Meeting room 1
Anker Engelundsvej 1
2800 Kgs. Lyngby

During the past couple of decades, use of electronics have increased in gigantic proportions. Use of power electronics in various sectors is a typical example as well as electrification of automotive sector. The device needs to be highly reliable for use in various climatic conditions. Humidity can cause reliability issues in electronics resulting in intermittent malfunctions and permanent failures; many of them are due to transient water film formation on PCBA surface under climatic exposure. Therefore understanding, finding preventive measures, and design for humidity robustness is important. There can be extrinsic methods keeping humidity level low or intrinsic methods increasing the robustness of the PCBA and components. As such preventive measures can be individually or used in combination.

Following previous years successful seminars, we are pleased to announce the 5th international seminar on climatic reliability of electronics. The two days seminar will cover various aspects of humidity issues in electronics elucidating failure mechanisms, influencing factors, humidity and climate modelling, and various preventive measures. This is a focused seminar with invited talks delivered by experts in various areas from industry and academia on various issues.

There will be extended focus on networking between participants during the evening programmes. The seminar attracts delegates from academia and industry. We are delighted to invite you to attend this important seminar. 

Seminar topics intended to cover, but not limited to:

  • Corrosion reliability issues of electronics and failures mechanisms
  • Humidity Issues related to low power and higher power electronics
  • Humidity effects on PCBA: Material, component, design, and process aspects
  • Electronic component level reliability issues
  • Enclosure aspects in controlling humidity issues
  • Moisture modelling and climate modelling for humidity effects prediction
  • Preventive measures: Intrinsic reliability of PCBA, coatings, and extrinsic methods to control humidity in the device

 

Organizers:
Professor Rajan Ambat, CELCORR, Technical University of Denmark
Dr. Morten Jellesen, CELCORR, Technical University of Denmark

Day 1 – Thursday 5 March 2020

Session 1 – Humidity interaction with PCBA and failure mechanisms

08:30 - 09:00 Registration and light breakfast
09:00 - 09:30 Overview of the seminar, and perspectives on the humidity effects on electronics

Rajan Ambag, CELCORR, DTU, Denmark

09:30 - 10:00 Corrosion behavior of printed electronics with silver traces

Laura Frisk, Trelic, Finland

10:00 - 10:30 Corrosion investigations on Bi and Mn micro-alloyed lead-free SAC alloys

Bálint Medgyes, BME, Budapest, Hungary

10:30 -11:00 Coffee break

Session 1 (continued) – Humidity interaction with PCBA and failure mechanisms

11:00 - 11:30 Electrochemical corrosion and thermal effects at voltages ≥ 12 V in electronics systems

Nicolas Mayer, Automotive Electronics Robert Bosch, Germany

Nicolas Mayer will give his talk on Skype

11:30 - 12:00 Carbonization of PCB material in relation to thermal incidents

Lutz Müller, Automotive Electronics Robert Bosch, Germany

Lutz Müller will give his talk on Skype

12:00 - 13:00 Lunch

Session 2 – Importance of process and service related residues

13:00 - 13:30 Interaction of PCBA Materials and flux systems: Reliability assement

Daniel Buckland, Henkel Ltd., United Kingdom

Daniel Buckland will give his talk on Skype

13:30 - 14:00 Does the measurement of ionic contamination predict reliability? Realization of IPC-J-STD001G-Am1 in the automotive Industry

Lothar Henneken, Automotive Electronics Robert Bosch, Germany

14:00 - 14:30 A validation tool for SMT-flux residues by infrared-spectroscopy based multi variate data analysis

Theresia Richter, Automotive Electronics Robert Bosch, Germany

14:30 - 15:00 Chemical composition, evolution, deliquescence and conductivity of aerosol deposited on the insulators of the Italian national power lines

Luca Ferrero, University of Milan Biccoca, Italy

Luca Ferrero will give his talk on Skype

15:00 - 15:30 Coffee break

Session 3 – Humidity and reliability of high power/low power systems and components

15:30 - 16:00 Studies on sprayed metal (schoopage) as humidity barrier in film capacitor

Lucia Cabo, TDK Electronics Components, Spain

16:00 - 16:30 Beyond humidity testing: Mixed Flowing Gas Tests on Power Electronics

Tommi Kärkkäinen, LUT University in Lappeenranta, Finland

16:30 - 17:00 Humidity-induced failures in state-of-the-art power semiconductor devices

Christian Zorn, University of Bremen, Germany

17:00 - 17:15 First day summary and bus transport to the dinner location

Day 2 – Friday 6 March 2020

08:15 - 08:30 Arrival and coffee

Session 3 (continued) – Humidity and reliability of high power/low power systems and components

08:30 - 09:00 Comparison of PCBs and DBCs concerning ECM and formation of dendrites

Chen Weiyi, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany

09:00 - 09:30 Field failures of electronics and power capacitors in railway application: Breakdowns related to environmental conditions and proposed countermeasures

Roland Schmid, Bombardier Transportation, Zurich

09:30 - 10:00 Study of the degradation of different thermoelectric modules at Teide volcano

Leyre Catalán Ros, Universidad Pública de Navarra, Spain

10:00 - 10:30 Challenges and requirements for reliable sinter interconnections

Markus Meier, Zestron, Germany

10:30 - 11:00 Coffee break

Session 4 – Humidity robustness testing, characterization methods and standards

11:00 - 11:30 Alternative Detection methods for Humidity Impacts on PCBAs

Simone Lauser, Automotive Electronics Robert Bosch, Germany

11:30 - 12:00 Complementary EIS / FTIR study of the degradation of adhesives in electronic packaging

Michael Schneider, Fraunhofer-Institut für Keramische Technologien und Systeme IKTS, Germany

12:00 - 13:00 Lunch

Session 4 (Continued) Humidity robustness testing, characterization methods and standards

13:00 - 13:30 Component Specific Test Boards and Electrical Test Methods for Assessing the Climatic Reliability of PCBAs

Mike Bixenman, Kyzen, USA

13:30 - 14:00 Reliability standards for cleanliness: protecting the future

Emma Hudson, GEN3 Systems, United Kingdom

Session 5 – Extrinsic methods for prevention of humidity effects

14:00 - 14:30 Mission profiling and corrosion classification: importance in relation to humidity effects on electronics

Morten Jellesen, CELCORR, Technical University of Denmark

14:30 - 15:00 Coffee break
15:00 - 15:30 Ultra-thin Fluoropolymer Coating: Performance and Ese in Electronics

Mélanie Mathon, Inventec Performance Chemicals, France

Mélanie Mathon will give her talk on Skype

15:30 - 16:00 Moisture absorption by polymer materials and impact on enclosure design

Helene Conseil, CELCORR, Technical University of Denmark

16:00 - 16:10 Conclusion and summary

Rajan Ambat, CELCORR, Technical University of Denmark

Attendance fee
4,500 kr. for members of ATV-SEMAPP or CreCon
5,000 kr. for non-members
All prices are excluded of Danish VAT.
The fee covers conference materials, lunch, coffee, and conference dinner and social events.
Upon registration we will send you an invoice.

Binding registration
Registration is binding, however substitutions are accepted at any time. Please let us know.

Conference dinner 5 March 2020
The conference dinner will be at Restaurant Charlottenlund Fort, Strandvejen 150, 2920 Charlottenlund

This seminar is organized by
Centre for Electronic Corrosion (CELCORR), DTU
European Federation of corrosion (EFC), WP 23 on Corrosion Reliability of Electronics
European Centre for Power Electronics (ECPE)