Climatic Reliability of Electronics:
Global Challenges and Perspectives

– The 8th International Seminar

16-17 March 2023

DTU Lyngby
Meeting room 1
Anker Engelundsvej 1
2800 Kgs. Lyngby

Electronic systems are exposed to all types of environmental conditions today, as they are part of all technological applications. Power electronics are integral part of applications such as renewable energy, transportation and automotive electrification. All these systems are expected to perform in a robust and reliable manner under exposed climatic conditions.

Humidity and other environmental conditions such as gases can generate a number of electro chemical failure modes, leading to intermittent functional issues and complete systems failures. While it is important to understand the robustness and reliability of the systems under expected environmental conditions, and how that result in functional issues, an equally important aspect is the understanding of failure mechanisms and conditions and parameters causing such issues. Understanding detailed mechanisms and their connection to functional issues will allow better Pro-active design and maintenance strategies for effective control.

This seminar will focus on these issues addressing both electronics and electrical aspects together with material and corrosion aspects bringing together electronics/electrical and material/corrosion experts. Broadly, the seminar will address topics related to low/high voltage and effect of environmental conditions on failure mechanisms, technology sector wise issues, material, design, and PCBA processing aspects in connection with humidity issues, and intrinsic and extrinsic preventive strategies.

Topics for the seminar will cover, but not limited to:

  • Electronics use for green transition technologies and issues related to exposure environment
  • Environmental reliability issues related to Electrification in transportation
  • Proper test methods for higher power/voltage electronics and challenges
  • Material, corrosion and mechanistic aspects of failure modes
  • Component level corrosion issues and failure mechanisms
  • PCBA design and process connection to environmental reliability
  • Intrinsic and extrinsic preventive measures including conformal coating, climate condition-based packaging etc.

Organizers:
Professor Rajan Ambat, CELCORR, Technical University of Denmark
Dr. Morten Jellesen, CELCORR, Technical University of Denmark

 

 

 

Day 1 - Thursday 16 March 2023

08:30 - 09:00
Registration and coffee

Session 1: Environmental issues of high power/low power systems, failure mechanisms, and testing

09:00 - 09:30
Introduction to the seminar and Importance of Environmental Effects on Electronics as a robustness and reliability issue

Rajan AmbatCenter for Electronic Corrosion, Technical University of Denmark

09:30 - 10:00
High Humidity High Temperature and High Voltage Reverse Bias - A Required Test for Power Semiconductors in Industrial Applications

Joonas LappanenABB, Finland

10:00 - 10:30
Accelerated Corrosive Gas Testing under High Voltage for Power Semiconductor Modules

Michael Hanf, University of Bremen, Germany

10:30 - 11:00
Coffee break
11:00 - 11:30
Risk Prediction of Electrochemical Migration on Electronic Control Units – A Practical Approach

Lothar HennekenRobert Bosch, Germany

11:30 - 12:00
Paradigm shift in cooling systems: Reliability challenge in condensing application giving high RH for electronic components – a field case

John B. Jacobsen and Preben Jakobsen, Grundfos, Denmark

12:00 - 13:00
Lunch break

Session 1 (continued): Environmental issues of high power/low power systems, failure mechanisms, and Testing

13:00 - 13:30
Insights into the microclimate in IGBT modules during lab-based wind-energy converter system tests

Christian ZornIWES, Fraunhofer Institute, Germany

13:30 - 14:00
Improvements on film capacitor performance under climatic stress

Azahara AlbendizTDK Electronics Components, S.A.U., Spain

14:00 - 14:30
Corrosion investigations on SAC-1Bi-xMn lead-free solder alloys

Medgyes Bálint Károly, BME Budapest, Hungary

14:30 - 15:00
Passivity of tin solder alloys

Michael SchneiderFraunhofer-Institut für Keramische Technologien und System IKTS, Germany

15:00 - 15:30
Coffee break
15:30 - 16:00
CAF Failures & High Voltage Applications

Angus BruntonIsola GmbH, Germany

16:00 - 16:30
Overcoming corrosion-related challenges of passive component integration into overmolded packages

Amar MavinkurveNXP Semiconductors, Netherlands

16:30 - 17:00
Development of a SIR test below 5V to Characterize ECM

Graham NaisbittGen3systems, UK

17:00 - 17:15
Corrosion-related activities in the European Power Electronics Network ECPE

Thomas HarderEuropean Center for Power Electronics, Germany

17:15 - 17:30
First day summary and bus transport to the dinner location
18:15 - 21:15
Seminar dinner

Day 2 - Friday 17 March 2023

08:15 - 08:30
Arrival and coffee

Session 2: Process cleanliness effect on corrosion reliability and optimization

08:30 - 09:00
Process cleanliness and safe boundaries for PCBA humidity robustness

Rajan Ambat, CELCORR, DTU, Denmark

09:00 - 09:30
Electronic Soldering Material Reliability when exposed to Harsh Climatic Conditions

Mike BixenmanMagnalytix, USA

09:30 - 10:00
Optical inspection and SIR measuring under the component bodies using SIR Glass Test Vehicle

Vladimír SítkoPBT Works, Czech Republic and Mike Bixenman, Magnalytix, USA

10:00 - 10:30
Investigation of the effect of ionic contamination in thin gaps on assemblies close to reality with new miniaturized devices

Helge SchimanskiFraunhofer-Institut für Siliziumtechnologie ISIT and Thorsten FladungFraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Germany

10:30 - 11:00
Coffee break
11:00 - 11:30
Rust particles, are they able to cause shorts

Lutz Mueller, Robert Bosch, Germany

11:30 - 12:00
UV LED conformal coating technologies

Marie Kaing, ABChimie, France

12:00 - 13:00
Lunch break

Session 3: Proper packaging and conformal coating for better protection from environmental effects

13:00 - 13:30
Integrated climate and CFD models for humidity effects verification on electronic packaging

Max Peter Spooner, DTU-Compute and Sankhya MohantyDTU-Construct, Denmark

13:30 - 14:00
Humidity robustness of thermally stressed coatings

Stefan Strixner, Zestron, Germany

14:00 - 14:30
An Efficient and Innovative Cleaning Solution with Low Environmental Impact

Laura LECOMTEInventec Performance Chemical, France

14:30 - 15:00
Coffee break
15:00 - 15:30
Plasma deposited thin halogen free conformal coating for corrosion protection of PCB

Nicolas Vandencasteele, Europlasma NV, Belgium

15:30 - 16:00
Flux residue compatibility with conformal coating: Parametric study and data modelling

Ioannis MantisCELCORR, DTU, Denmark

16:00 - 16:30
A sustainable Nanocoating technology for corrosion protection of electronics and medical devices

Rakesh KumarSpecialty Coating Systems, USA

16:30 - 16:40
Conclusion and summary

Rajan Ambat, CELCORR, Technical University of Denmark

Climatic Reliability of Electronics: Global Challenges and Perspectives 2023

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Attendance fee
4,995 kr. for members of ATV-SEMAPP or CreCon
5,495 kr. for non-members
All prices are excluded of Danish VAT.
The fee covers conference materials, lunch, coffee and conference dinner.
Upon registration we will send you an invoice.

Binding registration
Registration is binding, however substitutions are accepted at any time. Please let us know.

Conference dinner 16 March 2023
The conference dinner will held at the historic and iconic restaurant Brede Spisehus.

Hotels near DTU
Zleep hotel Lyngby  – approx. 500 meters from DTU
Scandic Eremitage – approx. 1,3 km from DTU

This seminar is organized by
Center for Electronic Corrosion (CELCORR), DTU
European Federation of corrosion (EFC), WP 23 on Corrosion Reliability of Electronics
European Center for Power Electronics (ECPE)