Climatic Reliability of Electronics: Global Challenges and Perspectives
– The 6th International Seminar
4-5 March 2021
Online via MS Teams
Today, electronic systems are exposed to all climatic conditions depending on the place of use. Use of power electronics for various applications is a typical example, as well as the use of electronics in the automotive sector. The device needs to be highly reliable under extreme climatic conditions. Humidity can cause reliability issues in electronics resulting in intermittent malfunctions and permanent failures; many of them are due to transient water film formation on PCBA or on other components under climatic exposure. Therefore, knowledge based design for climatic reliability and developing preventive strategies are important. Irrespective of whether the system is low power or high power, basic mechanisms operating under humid conditions have many similarities. There are several possibilities for preventive measures based on extrinsic methods keeping low humidity level or intrinsic methods by increasing the robustness of the PCBA and components.
Following the previous years successful seminars, we are pleased to announce the 6th (virtual) seminar on climatic reliability of electronics. The two days seminar will cover various aspects of humidity issues in electronics. This is a focused seminar with only invited talks delivered by experts from industry and academia on various issues. We are delighted to invite you to attend this seminar.
Topics for the seminar will cover, but not limited to:
- Corrosion reliability issues of electronics and failures mechanisms
- Humidity Issues related to low power and higher power electronics
- Humidity effects on PCBA: Material, component, design, and process aspects
- Humidity issues related to electrification and e-mobility
- Packaging design for climatic reliability
- Moisture modelling and climate modelling for prediction of humidity effects
- Preventive measures: Intrinsic reliability of PCBA, coatings, and extrinsic methods to control humidity in the device
Organizers:
Professor Rajan Ambat, CELCORR, DTU
Dr. Morten Jellesen, CELCORR, DTU
Thursday 4 March: Humidity interaction with electronic systems, components and mechanisms |
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Introduction to the seminar and humidity effects on electronics: where do we stand? Rajan Ambat, Center for Electronic Corrosion, DTU |
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Humidity robustness of vehicle electronics – SIR-tests with superimposed self-heating Lothar Henneken, Automotive Electronics, Robert Bosch, Germany |
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Analysis of dendritic corrosion phenomena on differently treated power electronic circuit Victoria Zimmermann, Fraunhofer Institute, Erlangen, Germany |
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Coffee Break | |||||
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Comparison between mixed flowing gas and flowers of sulphur corrosion testing Laura Frisk, Trelic, Finland |
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Humidity and material induced failure mechanisms in low and high voltage electronics Markus Meier, Zestron, Germany |
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Lunch Break | |||||
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The role of carbonaceous material in conductivity: laboratory test and ambient data Luca Ferrero, University of Milan Biccoca, Italy |
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Chloride containing Foreign Material in Epoxy Mold Compound Lena Saier and Lutz Muller, Automotive Electronics, Robert Bosch, Germany |
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Coffee Break | |||||
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Corrosion and humidity protection of next generation electronics through ultra-thin, organic coatings Rakesh Kumar, Vice President of Technology, Specialty Coating Systems, Inc., USA |
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The Forensics of Dendrite Shorting Terry Munson, Foresite, USA |
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Thursday summary | |||||
Friday 5 March: Humidity effect on electronics: Packaging, modelling humidity effects and testing |
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Key takeaways from an extrinsic corrosion mechanism during biased humidity tests in packages Amar Mavinkurve, NXP Semiconductors, Netherlands |
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Water uptake evaluation in plastic packages: FEM simulation modeling and data comparison with Electrochemical Impedance Spectroscopy experimental approach Sonia Morin, ST Microelectronics, Italy |
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Investigation of key influencing factors at automotive H2S-corrosion-testing Jennifer Rieder, Osram, Germany |
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Coffee Break | |||||
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Derivation of local humidity loads inside of vehicle electronics – simulation approach Balazs Toth, Automotive Electronics, Robert Bosch, Germany |
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Critical level of water film build up for failure and modelling condensation Helene Conseil Gudla & Alessandro Checchi, Mechanical Engineering, Technical University of Denmark |
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Lunch | |||||
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Effect of humidity on flux residues and how to test for aggressivity of flux residues Morten Jellesen, Mechanical Engineering, Technical University of Denmark |
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Advanced Humidity Testing under High Voltage Michael Hanf, University of Bremmen, Germany |
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Coffee Break | |||||
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Climate data analysis for humidity effects on electronics Max Peter Spooner & Murat Kulahci, DTU Compute, Technical University of Denmark |
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Why the IEC 60529 water protection standard must be changed? Michael Pecht, CALCE, University of Maryland, USA |
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Summary of seminar and concluding remarks | |||||
Registration fee
| DKK 1,595 | Members of ATV-SEMAPP and promoting organizations |
| DKK 1,995 | Non-members |
All prices are excluded of 25% Danish VAT
The fee covers online participation and conference materials
Upon registration we will send you an invoice.
Binding registration
Registration is binding, however substitutions are accepted at any time. Just remember to send us an e-mail at atv-semapp@mek.dtu.dk to let us know who will be replacing you.
This seminar is organized by
Centre for Electronic Corrosion (CELCORR), DTU
European Federation of corrosion (EFC), WP 23 on Corrosion Reliability of Electronics
European Centre for Power Electronics (ECPE)
